CVE-2017-18157
06.05.2019, 23:29
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.Enginsight
| Vendor | Product | Version |
|---|---|---|
| qualcomm | mdm9206_firmware | - |
| qualcomm | mdm9607_firmware | - |
| qualcomm | mdm9650_firmware | - |
| qualcomm | msm8909w_firmware | - |
| qualcomm | msm8996au_firmware | - |
| qualcomm | sd_210_firmware | - |
| qualcomm | sd_212_firmware | - |
| qualcomm | sd_205_firmware | - |
| qualcomm | sd_425_firmware | - |
| qualcomm | sd_450_firmware | - |
| qualcomm | sd_615_firmware | - |
| qualcomm | sd_616_firmware | - |
| qualcomm | sd_415_firmware | - |
| qualcomm | sd_625_firmware | - |
| qualcomm | sd_650_firmware | - |
| qualcomm | sd_652_firmware | - |
| qualcomm | sd_820_firmware | - |
| qualcomm | sd_820a_firmware | - |
| qualcomm | sd_835_firmware | - |
| qualcomm | sd_845_firmware | - |
| qualcomm | sdx20_firmware | - |
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= Vulnerable software versions
Common Weakness Enumeration