CVE-2018-11277
20.09.2018, 13:29
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.Enginsight
| Vendor | Product | Version |
|---|---|---|
| qualcomm | msm8909w_firmware | - |
| qualcomm | msm8996au_firmware | - |
| qualcomm | sd210_firmware | - |
| qualcomm | sd212_firmware | - |
| qualcomm | sd205_firmware | - |
| qualcomm | sd430_firmware | - |
| qualcomm | sd450_firmware | - |
| qualcomm | sd615_firmware | - |
| qualcomm | sd616_firmware | - |
| qualcomm | sd415_firmware | - |
| qualcomm | sd617_firmware | - |
| qualcomm | sd625_firmware | - |
| qualcomm | sd650_firmware | - |
| qualcomm | sd652_firmware | - |
| qualcomm | sd810_firmware | - |
| qualcomm | sd820_firmware | - |
| qualcomm | sd820a_firmware | - |
| qualcomm | sd835_firmware | - |
| qualcomm | sd845_firmware | - |
| qualcomm | sda660_firmware | - |
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= Vulnerable software versions
Common Weakness Enumeration