CVE-2019-13992

u'Out of bound memory access if stack push and pop operation are performed without doing a bound check on stack top' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Bitra, IPQ6018, IPQ8074, MDM9205, Nicobar, QCA8081, QCN7605, QCS404, QCS405, QCS605, QCS610, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Classic Buffer Overflow
ProviderTypeBase ScoreAtk. VectorAtk. ComplexityPriv. RequiredVector
NISTNIST
7.8 HIGH
LOCAL
LOW
LOW
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
qualcommCNA
---
---
CVEADP
---
---
Base Score
CVSS 3.x
EPSS Score
Percentile: 7%
VendorProductVersion
qualcommbitra_firmware
-
qualcommipq6018_firmware
-
qualcommipq8074_firmware
-
qualcommmdm9205_firmware
-
qualcommnicobar_firmware
-
qualcommqca8081_firmware
-
qualcommqcn7605_firmware
-
qualcommqcs404_firmware
-
qualcommqcs405_firmware
-
qualcommqcs605_firmware
-
qualcommqcs610_firmware
-
qualcommrennell_firmware
-
qualcommsa415m_firmware
-
qualcommsa6155p_firmware
-
qualcommsaipan_firmware
-
qualcommsc7180_firmware
-
qualcommsc8180x_firmware
-
qualcommsda845_firmware
-
qualcommsdm670_firmware
-
qualcommsdm710_firmware
-
qualcommsdm845_firmware
-
qualcommsdm850_firmware
-
qualcommsdx20_firmware
-
qualcommsdx24_firmware
-
qualcommsdx55_firmware
-
qualcommsm6150_firmware
-
qualcommsm7150_firmware
-
qualcommsm8150_firmware
-
qualcommsm8250_firmware
-
qualcommsxr1130_firmware
-
qualcommsxr2130_firmware
-
𝑥
= Vulnerable software versions